Effective chip on board LED packages revolution made by Samsung will help improve the overall manufacturing efficiency

Samsung Electronics Co., Ltd. has announced that it is introducing a new 129lm/W high efficiency, chip-on-board (COB) family of LED packages, LC013/26/40B, which features a compact light emitting surface (LES), designed for use in high performance indoor and outdoor lighting, and ideally suited for spotlight applications, which will benefit Led lights manufacturers. The Samsung’s COB family will be displayed at LIGHTFAIR International 2013, along with other LED packages, as well as new LED engines, lamps and L-Tubes. LIGHTFAIR International will be held at the Pennsylvania Convention Center in Philadelphia from April 23rd-25th.

   Samsung proudly presents its new 13, 26, and 40W, 129 lm/W high performance COB package family, based on our world class chip and phosphor technology. The new COB family, is designed to meet Zhaga specifications, and has a low thermal resistance and superior heat dissipation for high reliability not only for Solar led street lights but also indoor lighting.

The series - LC013/26/40B, features a 129lm/W light efficacy at 80 CRI (Color Rendering Index) and 5000K CCT (Correlated Color Temperature) and is available in 2700K, 3000K and 4000K versions. By adopting chip-on-board technology that utilizes metal core PCBs, the new COB family offers outstanding color uniformity and light quality, while achieving a high luminous flux of up to 6000lm in a single LED package.